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Centers poised to revolutionize microelectronics technologies


Los Alamos National Laboratory is spearheading a project to revolutionize the design and fabrication of integrated circuits, crucial components in electronic devices, to address energy efficiency and resilience in extreme environments. The Nano Solutions On-Chip project (NSOC), led by scientist Jennifer Hollingsworth, aims to utilize nanoscale semiconductors like quantum dots to enable the use of photons along with electrons for information transfer. This innovation promises to enhance energy efficiency and streamline manufacturing processes, potentially making circuits more resistant to radiation effects.

NSOC is part of a larger initiative, the Microelectronics Science Research Center (CHIME), which will focus on developing electronics resilient to extreme conditions. Collaborating with institutions such as the University of Pennsylvania and Columbia University, the project will explore diverse materials and technologies to optimize performance in challenging thermal and radiation environments.

The establishment of CHIME and another center focused on microelectronics energy efficiency highlights New Mexico’s pivotal role in advancing semiconductor technology. With expertise developed at Los Alamos National Laboratory and CINT, these centers aim to bridge the gap between lab research and industrial application, contributing to critical societal and industrial needs.

By combining experimentation, theory, and modeling, the projects within CHIME and NSOC will pave the way for breakthroughs in integrated circuit design. These efforts hold the potential to enhance national security by providing more efficient and robust electronic components for various applications, including space exploration and defense systems.

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